JPH0412677Y2 - - Google Patents

Info

Publication number
JPH0412677Y2
JPH0412677Y2 JP1986028334U JP2833486U JPH0412677Y2 JP H0412677 Y2 JPH0412677 Y2 JP H0412677Y2 JP 1986028334 U JP1986028334 U JP 1986028334U JP 2833486 U JP2833486 U JP 2833486U JP H0412677 Y2 JPH0412677 Y2 JP H0412677Y2
Authority
JP
Japan
Prior art keywords
resin
metal plate
case
heat dissipation
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986028334U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62140744U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986028334U priority Critical patent/JPH0412677Y2/ja
Publication of JPS62140744U publication Critical patent/JPS62140744U/ja
Application granted granted Critical
Publication of JPH0412677Y2 publication Critical patent/JPH0412677Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986028334U 1986-02-28 1986-02-28 Expired JPH0412677Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986028334U JPH0412677Y2 (en]) 1986-02-28 1986-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986028334U JPH0412677Y2 (en]) 1986-02-28 1986-02-28

Publications (2)

Publication Number Publication Date
JPS62140744U JPS62140744U (en]) 1987-09-05
JPH0412677Y2 true JPH0412677Y2 (en]) 1992-03-26

Family

ID=30831194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986028334U Expired JPH0412677Y2 (en]) 1986-02-28 1986-02-28

Country Status (1)

Country Link
JP (1) JPH0412677Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018128005A1 (ja) * 2017-01-06 2019-11-07 パナソニックＩｐマネジメント株式会社 コンデンサ、コンデンサユニット、コンデンサの製造方法およびコンデンサユニットの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56158460A (en) * 1980-05-12 1981-12-07 Mitsubishi Electric Corp Resin sealed type semiconductor device

Also Published As

Publication number Publication date
JPS62140744U (en]) 1987-09-05

Similar Documents

Publication Publication Date Title
JPH04233257A (ja) 大規模集積電子部品
JPH0412677Y2 (en])
JPH06302722A (ja) 放熱部材及びこの放熱部材を用いた半導体パッケージ
JPS6180842A (ja) 半導体装置
JPH03280453A (ja) 半導体装置及びその製造方法
JPH0338837Y2 (en])
JPH098224A (ja) 半導体モジュールと電力変換装置
JP2906635B2 (ja) 混成集積回路装置
JP2555522Y2 (ja) 樹脂封止型半導体装置
JP2960698B2 (ja) ヒートシンクを備えた樹脂封止型半導体装置及びその製造方法
JPS5812455Y2 (ja) 半導体装置用リ−ドフレ−ム
JPH11340377A (ja) 表面実装型半導体装置
JPH021862Y2 (en])
JPH0720921Y2 (ja) 樹脂密封型半導体装置
JP2725719B2 (ja) 電子部品及びその製造方法
JP2580905Y2 (ja) 半導体装置
JPS6018848Y2 (ja) 樹脂モ−ルド型半導体装置用リ−ドフレ−ム
JPH0521902Y2 (en])
JPH0747915Y2 (ja) 電子部品実装構造体
JPS5812447Y2 (ja) 半導体装置
JPS58223353A (ja) 半導体装置
JPS5835377B2 (ja) 電子機器の製造方法
JPS6022614Y2 (ja) 樹脂封止型半導体装置
JPS6246268Y2 (en])
JPS638108Y2 (en])